| Thin Film |
Hyung Il Kim |
Sputtering system(DC, RF, HSC) |
| Hae Ra Kang |
LP-CVD(Poly/Nitride, TEOS), Furnace(Wet, Dry), PECVD, AFM |
| Bo Seong Kim |
E-beam evaporator, ALD, PECVD |
| Etching |
Kang Oh Kim |
Dielectric RIE, Metal RIE, CCP etcher, RTP, Surface profiler |
| MIN JAE KIM |
Dielectric ICP etcher, Metal ICP etcher, FIB NX2000 |
| Seon jin Lee |
Deep Si etcher, NLD etcher, Dicing Saw, CMP |
| Photolithography |
Lu Da Lee |
E-beam lithography(JEOL, NBL) |
| Eun Jeong Hwang |
Laser lithography Probe station, Wire bonder, Photoresist Track system |
| Song Hee Lee |
E-beam lithography #attached, Mask aligner(MA6, MDA-400S) |